代表性论文、专利、论著:
[1] 鞠晓喆, R.Mahnken, 梁利华(通讯作者), 许杨剑(通讯作者). Goal-oriented mesh adaptivity for inverse problemsinlinear micro morphic elasticity,Computers and Structures,2021,257:1-21.
[2] 许杨剑, 翁焕博,鞠晓喆(通讯作者), 阮洪势,陈俊俊, Chen yuNan, 郭静, 梁利华(通讯作者). A method for predicting mechanical properties of composite microstructure with reduced dataset based on transfer learning,Composite Structures,2021, 275:1-14.
[3] 鞠晓喆, R.Mahnken, 许杨剑(通讯作者), 梁利华(通讯作者), 周旺民. A nonuniform transformation field analysis for composites with strength difference effects in elastoplasticity.International Journal of Solids and Structures,2021, 228:1-16.
[4] 翁焕博, 许杨剑, 陈俊俊, 阮洪势, Chen yu Nan, 梁利华, 鞠晓喆(通讯作者). An enhanced greedy algorithm for failure resistant material design with application to composite delamination,Composite Structures,2021,278:1-11.
[5] Liang Lihua, Wang Wei, Chen Junjun, Jiang Kunpeng, Sheng Yufeng, Peng X, Liu Aiping, Wu Huaping. Continuous Directional Water Delivery on the 3D-Printed Arrowhead Microstructure Array. MATERIALS, 2019,12 (7).
[6] Xu Yangjian,Zhao, Shuai,Jin Guohui,Liang Lihua(通讯作者),Jiang Haojie,Wang Xiaogui. Explicit dynamic fracture simulation of two-phase materials using a novel meso-structure modelling approach. COMPOSITE STRUCTURES. 2019, 208:407-417.
[7] 张继成, 张元祥, 王静, 梁利华(通讯作者). 电迁移不同失效模式的微观机理及其有限元寿命预测. 电子元件与材料, 2018,37 (9):9-15.
[8] 王静, 张元祥, 张继成,梁利华(通讯作者). 考虑晶粒结构的无铅焊点电迁移失效分析. 电子元件与材料, 2018,37 (7):14-21, 28.
[9] 张元祥, 梁利华(通讯作者), 张继成, 陈俊俊, 盛玉峰. 多物理场下 FCBGA 焊点电迁移失效预测的数值模拟研究. 力学学报, 2018, 50(3):487-496.
[10] Liang Lihua, Zhang Jicheng, Xu Yangjian, Zhang Yuanxiang, Wang Wei, Yang Jian. The effect of pressure and orientation on Cu-Cu3Sn interface reliability under isothermal ageing and monotonic traction via molecular dynamics investigation. MATERIALS & DESIGN, 2018, 149: 194-204.
[11] Zhang Jicheng, Yang Jian, Liang Lihua(通讯作者),Xu Yangjian,Guo Jing. A molecular dynamics investigation of the micro-mechanism for vacancy formation between Ag3Sn and beta Sn under electromigration. MOLECULAR PHYSICS, 2018, 116 (1): 99-106.
[12] Xu Yangjian, Zhao Shuai, Jin Guohui, Wang Xiaogui, Liang Lihua(通讯作者).Ductile fracture of solder-Cu interface and inverse identification of its interfacial model parameters. MECHANICS OF MATERIALS, 2017, 114: 279-292.
[13] 许杨剑, 武鹏伟, 赵帅, 王效贵,梁利华(通讯作者).弹塑性多尺度分析的实现及其在颗粒增强复合材料中的应用[J].复合材料学报, 2017,34(9):1934-1943.
[14] Jiang Hao-Jie,Liang Li-Hua(通讯作者), Ma Li, Guo Jing, Dai Hong-Liang, Wang Xiao-Gui. An analytical solution of three-dimensional steady thermodynamic analysis for a piezoelectric laminated plate using refined plate theory. COMPOSITE STRUCTURES, 2017, 162:194-209.
[15] Jiang, Hao-Jie; Wang, Xiao-Gui; Liang, Li-Hua(通讯作者). Three-dimensional steady thermodynamic analysis for a double-layer plate with a local heat source and harmonic load. APPLIED THERMAL ENGINEERING, 2016,106: 161-173.